Immerse yourself in the fascinating world of Microscopy. This short introduction course informs you of the incredible history of Microscopy. How it has shaped the world we live in today in terms of Technological, Biological, Medical and Environmental Innovation. It describes how microscopes work and function. It also includes a beginner’s guide on how to use the most common Low Magnification and High Magnification Stereo Microscopes, that you will come across in most labs in industry.

Learn about Photonics Devices and Systems – From Laser, Modulator and Receiver Device Physics, to a worldwide Optical Transport Network optimised with DWDM transmission. The learner will understand how the Telecomms Worldwide Systems function on a daily basis and the controls and regulations which govern it.

Learn about the fascinating subject of how Micro Chips are fabricated as wafers. Learn all about these Front End process steps and controls, which enable these Semiconductor chips to be grown at a wafer level. Without Wafer FABs producing micro chips, the society we live in would be like living in Victorian times.

So you have a Photonic Integrated Circuit (PIC), now… how do you package it? This course will cover the fundamental considerations in terms of Mechanical, Electrical, Thermal and Optical challenges, which need to be addressed and designed into your packaging solution.

In a world where AI and machine learning is a hugely fast growing industry, why not learn more about the mechanics of the physical movements within a typical automated processing machine. The course covers XY Linear Stages, Hexapods and most importantly the closed loop encoder feedback mechanisms, necessary to control these stages and movements. This will insure the automated robotic systems perform the tasks it was designed to fulfil.

High Reliability Device Packaging is key for Aerospace and Defence, Space, Sub Marine, Medical Implantable and Automotive Industries to name a few. These harsh environments demand the highest level of assembly quality and reliability where parts simply cannot fail. This course covers the high reliability process of void free die bonding and package lidding. It utilises the technology of Vacuum Reflow. This short intro course will explain more about the materials, equipment and processes involved to broaden your understanding and knowledge of this key technology.

Die Bonding is a key technology and process which is critical across all areas of Micro Electronics Assembly. From Photonics to Aerospace and Defence, Medical to RF, MEMS to Automotive and Transport. Die Bonding is everywhere! So a great skill to learn and understand.

Wire Bonding is the next process step after Die Bonding and is another key skill required for successful micro electronics assembly processes, across all micro electronics industry sectors. So extremely useful and applicable to many fast growing high value industries.

This introduction to SPC is designed to give the learner a taster of the quality control process and techniques of this key skill and analysis tool. Following on from this course, the learner may want to consider going for the industry recognised Green or Black Belt 6 Sigma SPC Qualifications.